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Integrated circuits combine a large number of transistors and other elementary electronic components in miniaturized form into a single physical device, that is designed for a specific purpose or function and characterized by its performance of that function rather than by the behavior of its component pieces. Examples include microcontrollers, battery monitors and charge controllers, analog to digital converters, operational amplifiers, logic gates, voltage regulators, gate drivers, motor controllers, and others.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tape & Reel (TR) | 16-SOIC | Surface Mount | - | 0°C ~ 70°C | |
| Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tube | 16-SOIC | Surface Mount | - | -40°C ~ 85°C | |
| Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tape & Reel (TR) | 16-SOIC | Surface Mount | - | -40°C ~ 85°C | |
![]() 2308-1HDCG $0.54 | Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tube | 16-SOIC | Surface Mount | - | 0°C ~ 70°C |
| Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tape & Reel (TR) | 16-SOIC | Surface Mount | - | 0°C ~ 70°C | |
| Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tube | 16-SOIC | Surface Mount | - | -40°C ~ 85°C | |
| Renesas Electronics Corporation | IC MULT ZDB 16SOIC | Tape & Reel (TR) | 16-SOIC | Surface Mount | - | -40°C ~ 85°C | |
| Renesas Electronics Corporation | IC MULT ZDB 16TSSOP | Tube | 16-TSSOP | Surface Mount | - | 0°C ~ 70°C |
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ISL6731BFBZView ProductRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
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Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
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On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
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On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
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Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
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WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
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Compare SPST and SPDT toggle switches, understand AC/DC ratings, and follow wiring examples. Check contact action, mounting and parts in the ChipApex catalog.
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
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Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
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CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
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What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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