SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Integrated circuits combine a large number of transistors and other elementary electronic components in miniaturized form into a single physical device, that is designed for a specific purpose or function and characterized by its performance of that function rather than by the behavior of its component pieces. Examples include microcontrollers, battery monitors and charge controllers, analog to digital converters, operational amplifiers, logic gates, voltage regulators, gate drivers, motor controllers, and others.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() 23LCV1024-I/SN $2.47 | Microchip Technology | IC SRAM 1MBIT SPI/DUAL 8SOIC | Tube | 8-SOIC | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 23LCV1024-I/ST $2.59 | Microchip Technology | IC SRAM 1MBIT SPI/DUAL 8TSSOP | Tube | 8-TSSOP | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 23LCV1024T-E/SN $1.94 | Microchip Technology | IC SRAM 1MBIT SPI/DUAL 8SOIC | Tape & Reel (TR) | 8-SOIC | Surface Mount | - | -40°C ~ 125°C (TA) |
![]() 23LCV1024T-E/ST $1.96 | Microchip Technology | IC SRAM 1MBIT SPI/DUAL 8TSSOP | Tape & Reel (TR) | 8-TSSOP | Surface Mount | - | -40°C ~ 125°C (TA) |
![]() 23LCV1024T-I/SN $2.55 | Microchip Technology | IC SRAM 1MBIT SPI/DUAL 8SOIC | Tape & Reel (TR),Cut Tape (CT) | 8-SOIC | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 23LCV1024T-I/ST $2.59 | Microchip Technology | IC SRAM 1MBIT SPI/DUAL 8TSSOP | Tape & Reel (TR),Cut Tape (CT) | 8-TSSOP | Surface Mount | - | -40°C ~ 85°C (TA) |
![]() 23LCV512-E/P $1.43 | Microchip Technology | IC SRAM 512KBIT SPI/DUAL 8DIP | Tube | 8-PDIP | Through Hole | - | -40°C ~ 125°C (TA) |
![]() 23LCV512-E/SN $1.39 | Microchip Technology | IC SRAM 512KBIT SPI/DUAL 8SOIC | Tube | 8-SOIC | Surface Mount | - | -40°C ~ 125°C (TA) |
BCM53416A0KFSBGView Product
LTC4352HMS#PBFView Product
PM6675ASTRView Product
SAF7843HL/M295,557View Product
ML22Q665-NNNTBZ0BXView Product
LMG3427R030RQZRView Product
MIC4422AAM-TRView Product
TDA2005MView Product
74LVC861AEPYView Product
LM3S817-IGZ50-C2TView Product
PCA9534ADGVRView Product
M2GL005S-1TQ144IView ProductSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
In the world of electronics, memory components play a critical role in system performance—and DRAM (Dynamic Random-Access Memory) is one of the most widely…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Select power transformers by input frequency, secondary VA, rectifier load, isolation, regulation and inrush. Build a clearer specification for your next RFQ.
Read More