SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Memory is a semiconductor device that is used as data storage device on an integrated circuit. These devices are available in several formats CBRAM, DRAM, EEPROM, EERAM, EPROM, Flash, FRAM, NVSRAM, PCM (PRAM), PSRAM, RAM, and SRAM in either Non-Volatile or Volatile. Memory sizes range from 64 b to 6 Tb with the interface being I2C, MMC, Parallel, eMMC, Serial, Single Wire, SPI, UFS, Xccela Bus, and 1-Wire.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tape & Reel (TR) | 100-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tray | 100-TQFP (14x14) | Surface Mount | - | -40°C ~ 85°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tape & Reel (TR) | 100-TQFP (14x14) | Surface Mount | - | -40°C ~ 85°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tray | 100-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tape & Reel (TR) | 100-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tray | 100-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tape & Reel (TR) | 100-TQFP (14x14) | Surface Mount | - | 0°C ~ 70°C (TA) | |
| Renesas Electronics Corporation | IC SRAM 256KBIT PARALLEL 100TQFP | Tray | 100-TQFP (14x14) | Surface Mount | - | -40°C ~ 85°C (TA) |

Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More