SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —

Modular connectors are a series of standardized interconnect products commonly used in wired information and telecommunications networks. Those in this family are plugs; the component of a mated connector pair which is typically affixed to a cable in this interconnect system, and which are distinguished among themselves principally by the number of contact positions available; and the number thereof in which contacts are present.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() A-2004-1-2-LP-N $0.76 | Assmann WSW Components | CONN MOD JACK 6P6C R/A | Tray | Through Hole | - | ||
![]() A-2004-1-2-LP/S-R $0.62 | Assmann WSW Components | CONN MOD JACK 6P6C R/A SHIELDED | Tray | Through Hole | - | ||
![]() A-2004-1-2-N $0.68 | Assmann WSW Components | CONN MOD JACK 6P6C R/A UNSHLD | Tray | Through Hole | - | ||
![]() A-2004-1-3 $0.71 | Assmann WSW Components | CONN MOD JACK 6P6C R/A UNSHLD | Tray | Through Hole | - | ||
![]() A-2004-1-3-LP-N $1.04 | Assmann WSW Components | CONN MOD JACK 6P6C R/A UNSHLD | Tray | Through Hole | - | ||
![]() A-2004-1-3-LP/S-R $0.68 | Assmann WSW Components | CONN MOD JACK 6P6C R/A SHIELDED | Tray | Through Hole | - | ||
![]() A-2004-1-3-N $0.73 | Assmann WSW Components | CONN MOD JACK 6P6C R/A | Tray | Through Hole | - | ||
![]() A-2004-1-4-LP-N $0.72 | Assmann WSW Components | MODULAR | Bulk | Through Hole | - |

Learn what an integrated circuit is, how ICs work, the main types and the specs to check before choosing a part for your design…
Read More
Understand RF attenuator dB values, fixed and programmable types, impedance, power limits and noise tradeoffs before choosing parts for an RF signal path.
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
On September 22nd, it was reported that Samsung Electronics, the South Korean tech giant, had successfully passed NVIDIA’s certification test for its 12-layer HBM3E…
Read More