1N1342

Single Diodes Overview

The Microchip Technology 1N1342 is a temperature-compensated Zener diode designed for precision voltage reference applications. It features a nominal Zener voltage of 11.7 V with a tight tolerance of 5%. The device operates at a test current of 7.5 mA and exhibits a low Zener impedance of 30 Ohms. With a maximum reverse leakage current of 15 µA, it ensures stable performance across an operating temperature range from 0°C to +75°C. Packaged in the DO-7-2 through-hole format, it dissipates up to 500 mW.

Single Diodes Feature Summary

• Temperature compensated design for enhanced stability
• Precision voltage regulation capability
• Low impedance characteristic for noise reduction

Single Diodes Applications

• Precision voltage reference circuits
• Temperature compensated regulator designs
• Stable biasing networks

Single Diodes Procurement Notes

Verify the specific suffix or variant against official Microchip documentation to ensure compatibility with required voltage tolerances and thermal characteristics. Confirm package integrity and lead configuration match the DO-7-2 specification before integration into printed circuit board layouts.

Single Diodes Selection Notes

Select this component when a stable, temperature-insensitive voltage reference is required in through-hole designs. The 11.7 V output level suits mid-range reference needs. Evaluate thermal management requirements to ensure power dissipation remains within the 500 mW limit during continuous operation.

Single Diodes Part Context

This part belongs to the Zener diode category within Microchip's discrete semiconductor portfolio. It serves as a specialized voltage reference solution distinct from standard rectification or general-purpose clamping diodes. The DO-7-2 package provides mechanical robustness suitable for industrial environments.

Single Diodes Replacement Considerations

Consult official substitution guides for equivalent temperature-compensated Zener diodes with matching 11.7 V nominal voltage and DO-7-2 packaging constraints.