1N4150UBD

Diode Arrays Overview

The Microchip Technology 1N4150UBD is a hermetically sealed silicon switching diode designed for high-reliability applications. It features a DO-35 glass package with copper-clad steel leads and tin/lead finish. The device supports an operating temperature range from -65°C to +175°C and handles a maximum DC reverse voltage of 50V. Key electrical characteristics include a forward voltage of up to 1.00V at 200mA, a reverse leakage current of 10µA at 75V, and a breakdown voltage of 75V minimum. It offers a peak reverse recovery time of 4ns and a total power dissipation of 500mW.

Diode Arrays Feature Summary

• Hermetically sealed construction in a DO-35 glass outline per MIL-PRF-19500/231 standards
• Double plug metallurgical bonding for enhanced structural integrity
• High-speed switching capability with low reverse recovery time
• Wide thermal operating range suitable for extreme environments

Diode Arrays Applications

• Military and aerospace signal processing circuits
• Computer diode logic arrays
• High-reliability rectification systems
• Harsh environment switching applications

Diode Arrays Procurement Notes

Verify the specific ordering suffix against the manufacturer's datasheet to ensure correct lead material and finish specifications. Confirm that the component meets the required MIL-PRF-19500/231 qualification level for your project. Cross-reference the marking code on the physical device with official documentation to authenticate the part before integration into critical systems.

Diode Arrays Selection Notes

Select this component when hermetic sealing and wide temperature tolerance are mandatory. The DO-35 case provides robust mechanical protection compared to non-hermetic alternatives. Ensure the circuit design accommodates the specified derating factor above 75°C ambient temperature to maintain reliability under continuous operation conditions.

Diode Arrays Part Context

This part belongs to the 1N4150 series of high-reliability switching diodes manufactured by Microchip Technology. It is specifically engineered for demanding environments where standard commercial components may fail. The UBD suffix typically denotes a specific packaging or qualification variant within the broader product family.

Diode Arrays Replacement Considerations

Direct replacements must match the DO-35 hermetic package and MIL-PRF-19500/231 compliance. Verify equivalent reverse voltage ratings and thermal resistance values. Consult Microchip for qualified cross-reference parts if exact suffix matching is not possible.

Diode Arrays FAQ

What is the maximum operating temperature for the 1N4150UBD?

The maximum operating temperature is +175°C.

Does the 1N4150UBD feature hermetic sealing?

Yes, it is hermetically sealed in a glass package per MIL-PRF-19500/231.

What is the peak reverse recovery time (TRR) specification?

The peak reverse recovery time is 4 nanoseconds.