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305-022-555-278 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 22POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-022-555-278 is a standard card edge connector header featuring 22 positions arranged in a dual-row configuration. It utilizes a 3.96 mm (0.156 inch) pitch and is designed for vertical panel mount installation with solder pin termination. The contacts are constructed from copper alloy with gold plating, rated for 5 A current. The insulator is made of green thermoplastic polyester, supporting board thicknesses of 1.57 mm. Operating temperatures range from -40°C to +105°C.
Verify the specific ordering suffix against official EDAC documentation to confirm exact contact type, insulation color, and mounting variations. Ensure compatibility with target PCB stack-up dimensions and mating card thickness specifications before procurement. Confirm RoHS compliance status through manufacturer datasheets rather than distributor summaries.
Select this component when a dual-row, 22-position connection with 3.96 mm pitch is required. Verify that the vertical panel mount style aligns with chassis constraints. Ensure the 1.57 mm board thickness specification matches the mating edge card requirements. Confirm thermal ratings suit the operational environment.
This part belongs to the EDAC 305 Series, which offers various position counts and mounting options. The series is characterized by robust thermoplastic construction and standardized 3.96 mm spacing. It serves as a reliable interface solution for high-density board-to-board or board-to-panel applications within industrial and commercial electronics sectors.
Cross-reference with EDAC 305-022-556-568 for similar specifications. Verify mechanical fit and electrical ratings match exactly. No direct substitutes from other manufacturers are confirmed without detailed engineering validation.
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