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305-024-556-208 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 24POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 305-024-556-208 is a standard card edge connector header from the 305 series, designed for panel mounting applications. It features 24 positions with a 3.96 mm (0.156 inch) pitch and supports dual-edge female contacts. The unit utilizes gold-plated copper alloy terminals with solder pin termination for secure electrical connection. Constructed with a thermoplastic insulator, it accommodates board thicknesses between 1.37 mm and 1.78 mm. Rated for 5 A current, it operates within a temperature range of -40°C to +105°C.
Verify the specific suffix codes against the official EDAC ordering guide to ensure correct flange and termination configurations. Confirm that the required card edge board thickness falls within the 1.37 mm to 1.78 mm specification range. Check RoHS compliance status directly in the datasheet before finalizing component selection for regulated assemblies.
Select this connector when a 24-position vertical interface with a 3.96 mm pitch is required. Ensure the application environment stays within the -40°C to +105°C operating temperature limits. Verify that the PCB stack-up allows for the specified 1.57 mm nominal board thickness compatibility. Consider the panel mount requirement as this unit is not designed for board-to-board stacking.
This component belongs to the EDAC 305 series of standard card edge connectors. The series offers various position counts and mounting options for panel-mounted headers. The 305-024-556-208 specifically provides a 24-position configuration with dual-edge female contacts and solder pin termination for robust industrial connectivity.
Compatible substitutes include other EDAC 305 series headers with matching 24 positions and 3.96 mm pitch, such as the 305-024-556-204 or 305-024-556-508, provided the flange and termination specifications align with the assembly requirements.
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