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326-41-132-41-002000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Mill-Max Manufacturing Corp.. Its product description is CONN RCPT 32POS 0.1 GOLD PCB. Review the specifications below when checking this part for your BOM.
The Mill-Max 326-41-132-41-002000 is a precision-machined interconnect component belonging to the 326 series. It functions as a single-row IC socket with a standard 0.100 inch (2.54 mm) pin spacing. The device features a wraparound post design intended for through-hole mounting on printed circuit boards. It is engineered to accept lead diameters ranging from 0.015 inches to 0.025 inches, ensuring secure mechanical and electrical connections for integrated circuits in various electronic assemblies.
Verify current availability status directly with the manufacturer or authorized distributors, as this specific part number may be subject to special order requirements. Confirm that the single-row socket geometry matches the target PCB footprint and that the lead diameter specifications align with the components being mounted. Ensure compliance with relevant environmental regulations before final procurement.
Select this component when a single-row, through-hole socket is required for standard pitch integrated circuits. The wraparound post design offers superior mechanical stability compared to standard sockets. Verify that the physical dimensions of the carrier accommodate the specific IC package height and width without interference from adjacent components on the assembly.
This component is part of the Mill-Max 326 series, which specializes in machined pin sockets. The series is characterized by its use of standard 0.100 inch spacing and through-hole technology. Mill-Max Manufacturing Corp produces these interconnects in the United States, emphasizing precision machining and vertical integration to maintain consistent quality standards across their product line.
No public confirmed substitute part numbers are available for this specific model.
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