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337-022-541-201 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists EDAC Inc.. Its product description is CONN EDGE DUAL FMALE 22POS 0.156. Review the specifications below when checking this part for your BOM.
The EDAC Inc. 337-022-541-201 is a standard card edge connector designed for dual female mating configurations. It features 22 positions with a 0.156-inch (3.96 mm) pitch, accommodating PCBs with a thickness of 0.156 inches and a maximum depth of 0.350 inches. The connector utilizes cantilever contact types with gold plating to ensure reliable signal transmission. Rated for 3 A current, it operates within a temperature range of -40°C to +105°C. The housing is constructed from green thermoplastic polyester, providing mechanical stability and insulation resistance of 5 GOhms.
Verify specific ordering suffixes against official EDAC documentation to confirm exact pin count, orientation, and plating specifications. Ensure compatibility with target PCB dimensions and mating card edge thickness. Confirm RoHS compliance status through manufacturer datasheets prior to integration into regulated assemblies.
Select this component when a dual-sided card edge interface is required for vertical or angled board mounting. The 0.156-inch pitch suits standard industrial PCB layouts. Verify that the cantilever contact style aligns with insertion force requirements and mating cycle expectations for the specific application environment.
This part belongs to the EDAC 337 Series, a line of standard card edge connectors. The series offers various position counts and mounting styles, including vertical and right-angle configurations. These connectors are engineered for durability in demanding sectors such as medical and agricultural technologies, emphasizing consistent performance under thermal stress.
No public confirmed substitute part numbers are documented for this specific model. Cross-referencing requires matching pitch, position count, and contact type. Consult EDAC technical support for validated alternatives if supply constraints exist.
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