351-10-135-00-003000

Headers, Male Pins Overview

The Mill-Max 351-10-135-00-003000 is a vertical header connector featuring 35 positions with a 2.54mm (0.100 inch) pin spacing. Designed for through-hole mounting, this component utilizes gold-plated contacts to ensure reliable signal transmission in electronic assemblies. The unit belongs to the standard 351 series of rectangular connectors manufactured by Mill-Max Manufacturing Corp., providing a robust interconnection solution for printed circuit boards.

Headers, Male Pins Feature Summary

• Vertical orientation design facilitates direct board-to-board or cable connections
• Through-hole termination method ensures secure mechanical attachment to PCBs
• Gold-plated contact surfaces provide corrosion resistance and stable conductivity

Headers, Male Pins Applications

• General-purpose electronic assembly interconnections
• Printed circuit board stacking applications
• Industrial control system wiring harnesses

Headers, Male Pins Procurement Notes

Verify current availability status directly with authorized distributors as lead times may vary. Confirm that the specific ordering suffix matches the required contact plating and housing material specifications for your application environment. Ensure compatibility with mating pins regarding dimensional tolerances before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a 35-position vertical header is required for through-hole implementation. Evaluate the 2.54mm pitch against existing board layout constraints. Consider the gold contact finish for environments requiring high reliability and low contact resistance compared to tin-plated alternatives.

Headers, Male Pins Part Context

This part belongs to the Mill-Max 351 series of rectangular connectors. The series offers various position counts and configurations tailored for diverse electronic packaging needs. As a standard product from Mill-Max, it adheres to established industry dimensions for pin spacing and housing geometry to ensure interoperability with compatible mating components.