71T75802S166BGG

Overview

The Renesas Electronics Corporation 71T75802S166BGG is a 18 Mbit synchronous static random-access memory (SRAM) organized as 1M x 18. It operates with a maximum clock frequency of 166 MHz and features an access time of 3.5 ns. The device utilizes a parallel interface and functions within a supply voltage range of 2.375 V to 2.625 V, with a maximum power current of 245 mA. It is housed in a 119-pin PBGA package designed for surface mount installation. The component supports an operating temperature range from 0°C to +70°C.

Feature Summary

• Zero Bus Turnaround (ZBT) architecture eliminates dead cycles between read and write operations
• Single R/W control pin simplifies bus control logic by removing separate output enable requirements
• Internally synchronized registers for address, data, and control signals enable fully pipelined applications

Applications

• High-performance system speed buffering
• Pipelined digital signal processing systems
• Network equipment data routing buffers

Procurement Notes

Verify the specific suffix BGG corresponds to the 119-pin PBGA package configuration. Confirm that the 0°C to +70°C commercial temperature range aligns with system requirements, as industrial variants may exist within the same family. Check for end-of-life status or alternative packaging options if long-term supply continuity is required.

Selection Notes

Select this component when a 18 Mbit capacity with 18-bit width is required for synchronous parallel interfaces. Ensure the design accommodates the 2.5V core and I/O voltage specifications. Verify that the 166 MHz performance meets the target system throughput needs and that the PBGA footprint fits the PCB layout constraints.

Part Context

This part belongs to the 71T75802 series of ZBT synchronous SRAMs. The series offers various speed grades and package options, including TQFP and PBGA configurations. The 71T75802S166BGG specifically represents the 166 MHz speed grade in the 119-pin PBGA form factor, providing high-speed data handling capabilities for embedded applications.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided documentation.