71V25761S183PFGI

Overview

The 71V25761S183PFGI is a synchronous single-data-rate static random-access memory (SRAM) manufactured by Renesas Electronics. It features a storage capacity of 4 Mbit organized as 128K x 36 bits. The device supports a maximum clock frequency of 183 MHz with an access time of 3.3 ns. It operates on a parallel interface with a supply voltage range of 3.135 V to 3.465 V and a maximum power current of 350 mA. The component is designed for surface-mount installation in a CABGA-165 package, supporting an operating temperature range from -40°C to +85°C.

Feature Summary

• Supports pipeline burst operations for high-speed data transfer
• Features synchronous architecture with single-data-rate capability
• Includes dedicated write enable control for precise data management

Applications

• High-performance computing systems requiring fast memory access
• Network infrastructure equipment demanding low-latency buffering
• Industrial automation controllers utilizing real-time data processing

Procurement Notes

Verify the specific suffix PFGI against official Renesas documentation to confirm the exact package type and temperature grade. Confirm RoHS compliance status through the manufacturer's latest datasheet. Check for obsolescence notices or lifecycle changes directly from Renesas Electronics before finalizing procurement plans.

Selection Notes

Select this component when a 128K x 36 organization is required for wide data bus applications. Ensure the system design accommodates the 3.3V logic levels and the specific 183 MHz timing constraints. Verify that the PCB layout supports the CABGA-165 footprint and thermal requirements for the specified industrial temperature range.

Part Context

This part belongs to the 71V35761 family of synchronous SRAMs. It shares architectural similarities with other members like the 71V35761SA166BQGI but differs in speed grade and package configuration. The 71V25761 series generally targets embedded applications needing reliable, high-speed volatile memory solutions within compact form factors.

Replacement Considerations

Publicly confirmed substitute part numbers are not available in the provided source material.