71V3556SA166BGGI

Memory IC Overview

The IDT71V3556SA166BGGI is a synchronous static random-access memory (SRAM) integrated circuit manufactured by Renesas Electronics Corporation. It features a storage capacity of 4.5 Mbit, organized as 128K words by 36 bits. The device operates with a maximum clock frequency of 166 MHz and supports a data access time of 3.5 ns. It utilizes a parallel interface and requires a supply voltage range of 3.135 V to 3.465 V. The component is housed in a 119-pin Plastic Ball Grid Array (PBGA) package measuring 14x22 mm. It is designed for industrial temperature ranges from 0°C to 70°C.

Memory IC Feature Summary

• Zero Bus Turnaround (ZBT) technology eliminates dead cycles between read and write operations.
• Fully pipelined architecture with internally synchronized output buffer enable.
• Supports four-word burst capability for interleaved or linear access patterns.
• Includes individual byte write control via dedicated BW1-BW4 pins.

Memory IC Applications

• High-speed digital signal processing systems
• Network infrastructure equipment requiring low-latency buffering
• Industrial automation controllers
• Embedded systems with parallel memory interfaces

Memory IC Procurement Notes

Verify the specific suffix BGGI against official Renesas documentation to confirm the 119-pin PBGA package and commercial temperature range. Confirm current manufacturing status as this series may be subject to discontinuation notices. Ensure compatibility with existing PCB footprints for the 14x22 mm BGA form factor before procurement.

Memory IC Selection Notes

Select this component when zero bus turnaround performance is critical for system throughput. The 36-bit word width suits applications requiring wide data paths without complex multiplexing. Verify that the 166 MHz speed grade meets the target system clock requirements. Consider the 119-pin BGA package constraints for thermal management and board space availability.

Memory IC Part Context

This part belongs to the 71V3556 family of ZBT synchronous SRAMs. It shares architectural similarities with other variants like the 71V3556S166BQGI but differs in package type and operating temperature specifications. The family is designed for high-performance embedded memory applications where fast turnaround times are essential.

Memory IC Replacement Considerations

Check for direct pin-compatible replacements within the same speed grade. Verify if alternative packages such as CABGA offer equivalent electrical characteristics. Consult manufacturer obsolescence notices for end-of-life status and recommended next-step parts.