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A-WBP-D003EG-12TB01 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists Assmann WSW Components. Its product description is WIRE-TO-BOARD, WAFER, 1.25MM, 12. Review the specifications below when checking this part for your BOM.
The A-WBP-D003EG-12TB01 is a wire-to-board connector header manufactured by Assmann WSW Components. It features a 12-position configuration with a 1.25mm (0.049 inch) pin spacing. The component utilizes through-hole termination for secure PCB mounting and employs friction lock fastening mechanisms to ensure stable mating connections. Designed for reliable signal transmission, it supports standard industrial operating temperatures.
Verify the specific manufacturer part number against official Assmann WSW documentation to confirm pin count and pitch specifications. Ensure compatibility with mating connectors regarding locking mechanisms and termination methods. Request current RoHS compliance certificates and datasheets directly from authorized distributors or the manufacturer to validate technical parameters before procurement.
Select this component when a compact 12-pin connection is required with a 1.25mm grid. Verify that the application environment falls within the standard operating temperature range. Confirm that the through-hole mounting method aligns with the printed circuit board design constraints and that the friction lock feature meets the mechanical retention requirements of the assembly.
This part belongs to the A-WBP series of wire-to-board connectors from Assmann WSW Components. This series provides various position counts and pitch options for diverse connectivity needs. The specific model represents a standardized solution for reliable electrical connections in consumer and industrial electronics applications requiring precise alignment.
Consult official cross-reference lists from Assmann WSW Components for verified substitute part numbers. Ensure any replacement maintains identical pin count, pitch, and termination type to guarantee mechanical and electrical compatibility without redesigning the host system.
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