A-WBP-D006EG-15SR01

Headers, Male Pins Overview

The A-WBP-D006EG-15SR01 is a wire-to-board header manufactured by Assmann WSW Components. It features a wafer format designed for surface mounting applications. The connector provides 15 positions with a precise pitch of 1.25 mm. This configuration supports reliable electrical interconnections in compact electronic assemblies requiring high-density pin arrangements.

Headers, Male Pins Feature Summary

• Wafer format design optimized for surface mount technology integration
• 1.25 mm pitch spacing ensures consistent signal alignment
• 15-position configuration accommodates multi-signal routing

Headers, Male Pins Applications

• Wire-to-board interconnections in consumer electronics
• Surface mount assembly for compact circuit boards
• Signal routing in high-density electronic modules

Headers, Male Pins Procurement Notes

Verify the exact part number against manufacturer documentation to ensure compatibility with surface mount processes. Confirm that the 1.25 mm pitch and 15-position specifications match the target PCB footprint requirements. Cross-reference material properties and termination types with system design constraints before procurement.

Headers, Male Pins Selection Notes

Select this component when a 15-position surface mount header is required. The 1.25 mm pitch dictates trace spacing on the PCB layout. Ensure the wafer format aligns with available board space and mating cable or harness configurations. Validate thermal and mechanical performance within the specific application environment.

Headers, Male Pins Part Context

This component belongs to the A-WBP series of wire-to-board headers from Assmann WSW Components. The series offers various position counts and pitch options. The 15-position variant serves as a specialized solution for applications needing more connections than standard smaller headers provide while maintaining a low profile.

Headers, Male Pins Replacement Considerations

Compatible substitutes include other 1.25 mm pitch, 15-position surface mount headers from different manufacturers. Verify mechanical dimensions, contact plating, and locking mechanisms before substitution. Ensure the replacement maintains the same wafer form factor and current rating specifications.