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AGFA012R24B3E4X is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Altera. Its product description is IC FPGA AGILEX-F 2486FBGA. Review the specifications below when checking this part for your BOM.
The AGFA012R24B3E4X is an Agilex 7 F-series System on Chip FPGA featuring a 1.2M logic element fabric and an integrated quad-core ARM Cortex-A53 processor running at 1.4GHz. It includes 256KB of embedded RAM and supports high-speed connectivity via Ethernet, USB OTG, SPI, I2C, UART/USART, MMC/SD/SDIO, and EBI/EMI interfaces. The device operates within a junction temperature range of 0°C to 100°C and utilizes a 2340-ball FBGA package with 744 available I/Os.
Verify the specific suffix B3 against official Intel/Altera documentation to confirm manufacturing lot or revision details, as suffixes often denote process corners or quality grades. Confirm moisture sensitivity level (MSL) requirements for your assembly line. Ensure ECAD models are sourced from official manufacturer repositories to guarantee accurate footprint and thermal data integrity during PCB design.
Select this component when a unified solution combining hard processor system execution with soft logic flexibility is required. Compare the 1.2M LE density against higher-end Agilex models if cost or power constraints exist. Verify that the 2340-FBGA package size fits within your mechanical enclosure and that the 744 I/O count satisfies all signal routing requirements without excessive pin multiplexing.
This part belongs to the Agilex 7 F-family, designed for mid-to-high volume applications balancing performance and power efficiency. It sits below the larger AGFA023 series in terms of logic capacity but shares the same core processor architecture and interface peripherals, allowing for potential design reuse across different density tiers within the same product line.
Direct replacements within the Agilex 7 F-family include AGFA012R24C2E4X and AGFA012R24C3E3V, which share identical logic densities and processor cores. Verify that any alternative suffix indicates compatible electrical characteristics and package dimensions before substitution to ensure pinout and thermal performance remain unchanged.
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