AS4C64M16D3L-12BCN

Memory IC Overview

The AS4C64M16D3L-12BCN is a 1 Gbit (64 M x 16) DDR3 SDRAM manufactured by Alliance Memory. It operates at a maximum clock frequency of 800 MHz and supports data transfer rates up to 1600 Mbps. The device utilizes a 96-ball FBGA package and functions within a voltage range of 1.283 V to 1.45 V. It is rated for commercial temperature operation, spanning from 0°C to +95°C. Key features include auto-refresh and self-refresh capabilities, multi-bank page burst access modes, and compliance with JEDEC standards for clock jitter.

Memory IC Feature Summary

• Supports high-speed data transfers via double data rate architecture
• Includes automatic and self-refresh functions to maintain system performance
• Utilizes multi-bank page burst access mode for efficient data handling

Memory IC Applications

• Consumer electronics requiring compact memory solutions
• Industrial control systems operating in commercial temperature ranges
• Embedded computing platforms needing low-power DRAM

Memory IC Procurement Notes

Verify the specific suffix 'BCN' against official datasheets to confirm commercial temperature grade and tray packaging format. Ensure compatibility with 1.35V/1.5V I/O levels. Confirm moisture sensitivity classification and reflow soldering profiles prior to assembly. Cross-reference part numbers with manufacturer updates to avoid obsolete stock.

Memory IC Selection Notes

Select this component when a 1 Gbit density with a 16-bit interface is required in a small form factor. It is suitable for designs prioritizing power efficiency through DDR3L voltage options. Consider the 800 MHz speed grade for applications not requiring higher bandwidth. Verify that the commercial temperature range meets the environmental constraints of the target deployment.

Memory IC Part Context

This part belongs to the Alliance Memory AS4C64M16D3L series of low-voltage DDR3 SDRAMs. It shares architectural similarities with other members of the family but differs in capacity, organization, and specific suffix designations for temperature and packaging. It serves as a drop-in replacement for legacy SDRAM in many modern embedded designs.

Memory IC Replacement Considerations

Check for direct substitutes such as AS4C64M16D3LC variants if industrial temperature ratings are needed. Verify pinout and electrical specifications against competitors like ISSI or Micron before substitution.