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AUIRFS3004-7P is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 40V 240A D2PAK-7. Review the specifications below when checking this part for your BOM.
The AUIRFS3004-7P is an automotive-grade, single N-channel HEXFET power MOSFET from Infineon Technologies. It utilizes Gen 10.7 technology and is housed in a D2PAK (TO-263) 7-pin surface-mount package. The device features a maximum drain-source voltage of 40V and a typical on-resistance of 1.75mΩ at 10V gate drive. It supports continuous drain currents up to 195A at 25°C and dissipates up to 380W of power. Operating within a junction temperature range of -55°C to 175°C, it meets AEC-Q101 standards for automotive reliability.
Verify the specific suffix '-7P' against official Infineon documentation to confirm tape-and-reel packaging specifications. Ensure the component matches the required AEC-Q101 quality grade for your target application. Cross-reference the datasheet revision date to confirm technical parameters align with current manufacturing standards before finalizing procurement.
Select this component when designing circuits requiring automotive-grade reliability combined with low conduction losses at 40V. The D2PAK package offers a balance between thermal dissipation and board space efficiency. Consider the gate charge characteristics for switching frequency requirements and ensure the PCB layout supports the high current capabilities specified in the thermal resistance data.
This part belongs to Infineon's OptiMOS™ power MOSFET portfolio, specifically tailored for automotive environments. It represents the Gen 10.7 generation, focusing on reducing footprint while maintaining high current handling. The product line is designed to support the increasing electrical loads found in modern mobility solutions, providing a robust solution for power switching tasks.
Direct substitutes include IRFS3004-7P for non-automotive contexts or AUIRFS3004 for alternative automotive sourcing. Verify pinout compatibility and thermal characteristics when transitioning between these variants to ensure circuit integrity without redesigning the heat sink interface.
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