AUIRL1404S

Single FETs, MOSFETs Overview

The AUIRL1404S is an automotive-grade N-channel HEXFET power MOSFET utilizing advanced planar technology. It features a maximum drain-source voltage of 40V and a maximum on-resistance of 4.0mΩ at VGS=10V. The device supports a continuous drain current of 160A at 25°C case temperature and handles pulsed currents up to 640A. Total gate charge is typically 140nC. It operates within a junction temperature range of -55°C to +175°C and is fully avalanche rated.

Single FETs, MOSFETs Feature Summary

• Advanced planar design for low on-resistance per silicon area
• Logic level gate drive capability
• Fast switching performance with ruggedized device design
• Fully avalanche rated with repetitive avalanche allowance

Single FETs, MOSFETs Applications

• Automotive applications requiring high reliability
• High efficiency power conversion systems
• Circuits demanding fast switching speeds

Single FETs, MOSFETs Procurement Notes

Verify the specific package variant, as the 'S' suffix denotes D2-Pak while 'L' denotes TO-262. Confirm that the application environment adheres to the specified thermal resistance limits and absolute maximum ratings to ensure long-term reliability in automotive conditions.

Single FETs, MOSFETs Selection Notes

Select this component for designs requiring robust automotive qualification and high current handling capabilities. Ensure the gate drive circuitry supports the logic level requirements and that the PCB layout accommodates the thermal dissipation needs associated with the D2-Pak package.

Single FETs, MOSFETs Part Context

This part belongs to the HEXFET family of power MOSFETs from Infineon Technologies. It is specifically engineered for automotive environments, offering enhanced durability compared to standard industrial components. The product line emphasizes efficiency through optimized silicon area usage.

Single FETs, MOSFETs Replacement Considerations

The base part number for the TO-262 package variant is AUIRL1404L. Verify pinout compatibility and thermal characteristics when substituting between package types.