BGA777L7E6327XTSA1

$0.39

Description：IC AMP UMTS 2.3/2.7GHZ TSLP7-1
Series：-
Mfr：Infineon Technologies
Package：Tape & Reel (TR),Bulk

SKU:56873491e6b9 Category: RF Amplifiers Brand: Infineon Technologies

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Product introduction

BGA777L7E6327XTSA1 is listed in the RF Amplifiers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC AMP UMTS 2.3/2.7GHZ TSLP7-1. Review the specifications below when checking this part for your BOM.

RF Amplifiers specifications for BGA777L7E6327XTSA1

Description：IC AMP UMTS 2.3/2.7GHZ TSLP7-1
Series：-
Mfr：Infineon Technologies
Package：Tape & Reel (TR),Bulk
Frequency：2.3GHz, 2.7GHz
P1dB：-11dBm
Gain：16.8dB
Noise Figure：1.2dB
RF Type：UMTS
Voltage - Supply：2.6V ~ 3V
Current - Supply：10mA
Test Frequency：2.3GHz
Mounting Type：Surface Mount
Package / Case：6-XFDFN Exposed Pad
Supplier Device Package：PG-TSLP-7-1
Grade：-
Qualification：-

RF Amplifiers datasheet and documents for BGA777L7E6327XTSA1

BGA777L7E6327XTSA1

RF Amplifiers Overview

The BGA777L7E6327XTSA1 is an RF amplifier module manufactured by Infineon Technologies, designed for high-frequency signal processing applications. It utilizes silicon technology and is housed in a compact 6-XFDFN Exposed Pad (PG-TSLP-7-1) surface-mount package. The component operates at a frequency of 2.3 GHz with a continuous collector current rating of 10 mA. This monolithic microwave integrated circuit (MMIC) is engineered to provide efficient amplification within wireless communication systems.

RF Amplifiers Feature Summary

Integrated RF amplifier module optimized for high-frequency signal processing
Compact surface-mount packaging suitable for space-constrained designs
Silicon-based construction ensuring reliable performance in wireless applications

RF Amplifiers Applications

High-frequency signal processing in wireless communication devices
RF front-end modules requiring compact amplifier solutions
Wireless infrastructure components operating at 2.3 GHz

RF Amplifiers Procurement Notes

Verify the specific ordering suffix and package variant when sourcing replacements, as minor differences may exist between distributors. Confirm that the 6-XFDFN Exposed Pad footprint matches your PCB layout requirements. Ensure compatibility with existing design specifications before procurement.

RF Amplifiers Selection Notes

Select this component for applications requiring a dedicated RF amplifier at 2.3 GHz. Consider the 10 mA current rating and XFDFN package dimensions during thermal and spatial planning. Evaluate system-level gain and noise requirements against the module's capabilities to ensure optimal signal integrity.

RF Amplifiers Part Context

This part belongs to the BGA777 series of RF amplifiers from Infineon Technologies. These modules are typically used in wireless LAN and other communication systems. The BGA777L7 variant specifically targets high-frequency operations with a focus on integration and efficiency in modern electronic designs.