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BLY 3 34 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists Fischer Elektronik. Its product description is for 0.5 mm and up to 0.56 mm. Review the specifications below when checking this part for your BOM.
The BLY 3 34 is a 34-position board-to-board header connector manufactured by Fischer Elektronik. It features a 2.00 mm (0.079 inch) pitch and utilizes through-hole mounting with an angled configuration. The contacts are gold-plated to ensure reliable electrical performance. Designed for conductor diameters between 0.5 mm and 0.56 mm, the component offers an insert depth of 2.5 mm to 3.8 mm. Mechanical specifications include an insertion force of 1.3 N and a drawing force of 0.3 N, alongside shock resistance rated at 50 g.
Verify that the required connector matches the specific 34-position count and 2.00 mm pitch dimensions. Confirm the angled through-hole mounting style aligns with the PCB layout requirements. Ensure the application environment supports the specified mechanical shock resistance and contact plating standards for long-term reliability.
Select this component when a high-density, angled connection is required for rigid board-to-board interfaces. The 2.00 mm pitch allows for moderate pin density while maintaining robust mechanical stability. Consider the through-hole mounting method if surface-mount alternatives are unsuitable for the assembly process or structural needs.
This part belongs to the BLY 3 series of headers from Fischer Elektronik, a German manufacturer established in 1969. The company specializes in electronic components and thermal management solutions. This specific model represents a standard industrial-grade connector designed for durable applications within the broader portfolio of board-level interconnects.
Direct substitutes must match the 34-position count, 2.00 mm pitch, and angled through-hole form factor. Verify compatibility with the 0.5–0.56 mm conductor diameter range. Cross-reference mechanical dimensions and plating specifications to ensure functional equivalence without redesigning the host PCB.
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