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BU7294FV-E2 is listed in the Instrumentation, Op Amps, Buffer Amps range at ChipApex. The manufacturer field lists Rohm Semiconductor. Its product description is IC CMOS 4 CIRCUIT 14SSOPB. Review the specifications below when checking this part for your BOM.
The BU7294FV-E2 is a four-channel CMOS operational amplifier manufactured by ROHM Semiconductor, housed in an SSOP-B14 package. It features a gain-bandwidth product of 2.8 MHz and a slew rate of 3 V/µs. The device operates on a supply voltage ranging from 2.4 V to 5.5 V with a typical quiescent current of 0.5 mA per channel. Key electrical specifications include a maximum input offset voltage of 9 mV, an input bias current of 1 pA, and an output current capability of 8 mA. It supports full-swing input and output operation within the supply rails.
Verify the specific suffix E2 against the manufacturer's latest datasheet to confirm compliance with RoHS directives and material declarations. Confirm that the SSOP-B14 package dimensions match your PCB footprint requirements. Ensure the operating temperature range of -40°C to +85°C aligns with your system's environmental conditions before finalizing procurement.
Select this component when full-signal swing is required at both input and output nodes within a low-voltage environment. The 1 pA input bias current makes it suitable for high-impedance sensor applications where leakage must be minimized. Compare its 2.8 MHz bandwidth against higher-speed alternatives if signal fidelity at elevated frequencies is critical for your design.
This part belongs to the BU729x series of CMOS operational amplifiers designed for low-voltage, low-power applications. The series emphasizes rail-to-rail capabilities and high speed relative to its power consumption profile. It serves as a standard-grade solution for consumer electronics and industrial control systems requiring multi-channel amplification.
Consult official substitution guides for compatible quad-channel op-amps with similar GBW and supply voltage ranges. Verify pin compatibility and thermal characteristics before replacing the original component in existing designs.
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