SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The CED40 is a panel-mount junction box manufactured by Hoffman Enclosures, Inc. Constructed from steel with an Xtra Small form factor, it measures 4 x 4 x 3 inches (102 x 102 x 76 mm). The enclosure features a continuous hinge design and screw-down clamps for secure closure. It carries an IP66 rating and NEMA Type 12 classification, ensuring protection against dust, water jets, and dripping non-corrosive liquids. The unit utilizes oil-resistant gaskets and ANSI 61 Gray polyester powder paint for corrosion resistance.
Verify that the specific application environment aligns with the NEMA 12 and IP66 ratings provided. Confirm that the required internal dimensions accommodate all components with adequate clearance. Ensure mounting hardware matches the panel thickness and hole configuration specified for the 4x4x3 inch footprint.
Select this model when a compact, hinged steel enclosure is required for panel mounting. The CED40 is suitable for applications needing protection against dust and light water exposure without the bulk of larger enclosures. Consider the continuous hinge feature if frequent access is necessary compared to removable lid designs.
This component belongs to the Hoffman Enclosures line of metal junction boxes designed for industrial use. It serves as a protective housing for electronic and electrical systems, offering durability through steel construction and specialized coatings. The product is part of a range of standard sizes available for various mounting and protection requirements.
No public confirmed substitute part numbers are available in the source data. Verify compatibility with existing mounting brackets and cable entries before considering alternative manufacturers.

Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Learn how a JFET works and how to compare bias, leakage, noise and pinout. Review practical selection questions for high-impedance analog circuits.
Read More
Learn what data acquisition means, from sensors and conditioning to sampling and storage. Review channel timing, wiring, calibration and data quality.
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More