CP188-BC107A-CT

Single Bipolar Transistors Overview

The CP188-BC107A-CT is a bare die NPN silicon epitaxial planar transistor manufactured using the Central Semiconductor CP188 process. Designed for low-noise amplifier applications, the component features a die size of 14.6 x 14.6 mils and a thickness of 9.0 mils. It utilizes aluminum top-side metalization and gold-arsenic back-side collector metallization. The device is supplied in singulated waffle pack trays.

Single Bipolar Transistors Feature Summary

• Epitaxial planar construction optimized for low-noise amplification
• Gold-arsenic back-side collector metallization for thermal performance
• Singulated die configuration suitable for custom packaging

Single Bipolar Transistors Applications

• Low noise amplifier circuits
• Signal processing stages
• Driver stages requiring high fidelity

Single Bipolar Transistors Procurement Notes

Verify current availability status as the CP188 wafer process has been discontinued. Confirm if existing inventory remains or if transition to the replacement CP388X process is required. Contact engineering support for specific screening requirements or alternative sourcing options if standard stock is unavailable.

Single Bipolar Transistors Selection Notes

Select this component when designing discrete semiconductor solutions requiring specific bare die characteristics for custom assembly. Ensure the design accommodates the physical dimensions and metallization specifications provided. Evaluate the transition to the CP388X process if long-term supply continuity is a priority for the application.

Single Bipolar Transistors Part Context

This part belongs to the Central Semiconductor bare die portfolio, utilizing the legacy CP188 manufacturing process. It represents a specialized offering for customers requiring direct access to semiconductor dies rather than packaged components. The product line focuses on niche and custom discrete semiconductor needs.

Single Bipolar Transistors Replacement Considerations

The official replacement part number is CP388X-BC107A-CT. The CP188 process is classified as End of Life. Transition to the CP388X wafer process is recommended for new designs to ensure ongoing production capability.