CPT30060

Diode Arrays Overview

The CPT30060 is a Schottky PowerMod diode module manufactured by Microsemi Corporation. It features a common cathode configuration with two elements housed in an MD3CC base-mounted package. The device supports a maximum repetitive reverse voltage of 60V and provides an average forward current of 150A per leg, totaling 300A per package. Key electrical characteristics include a maximum peak forward voltage of 0.82V at 200A and a typical junction capacitance of 4300pF per leg. The module operates within a junction temperature range of -55°C to 175°C.

Diode Arrays Feature Summary

• Schottky barrier rectifier technology for high-efficiency switching
• Guard ring protection structure for enhanced reliability
• Baseplate mounting design with nickel-plated copper construction

Diode Arrays Applications

• High power DC-DC conversion systems
• Industrial motor drive freewheeling circuits
• High frequency inverter applications

Diode Arrays Procurement Notes

Verify the specific suffix designation required for your circuit topology. The standard CPT30060 denotes a common cathode configuration. Suffix A indicates a common anode variant, while suffix D specifies a doubler configuration. Confirm that the selected part matches the intended polarity requirements before procurement to ensure correct integration into the power stage.

Diode Arrays Selection Notes

Select this component based on its 60V reverse voltage rating and 150A per-leg current capacity. Ensure the thermal management system can handle the specified thermal resistance values, which are 0.40°C/W junction-to-case without grease and 0.20°C/W with grease. Verify that the mounting torque specifications for the center hole (30-40 inch pounds) and outside holes (35-50 inch pounds) are strictly adhered to during installation.

Diode Arrays Part Context

This component belongs to the Microsemi Schottky PowerMod series, designed for high-current power electronics applications. It utilizes silicon Schottky barrier technology to minimize forward voltage drop and switching losses compared to standard PN junction rectifiers. The module format allows for efficient heat dissipation through the baseplate, making it suitable for robust industrial environments requiring high reliability.

Diode Arrays Replacement Considerations

Cross-reference with MBR30060CT or MBRP30060CT for similar performance profiles. Verify pinout compatibility and thermal interface dimensions when substituting. Note that package styles may differ between discrete modules and traditional TO-247 packages, requiring mechanical adaptation.