Diode Arrays CTXS-4603S product image

CTXS-4603S

  • Description:DIODE ARRAY GP 300V 60A TO-3P
  • Series:-

SKU:c8311659e107 Category: Brand:

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CTXS-4603S is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Sanken Electric USA Inc.. Its product description is DIODE ARRAY GP 300V 60A TO-3P. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for CTXS-4603S

  • Description:DIODE ARRAY GP 300V 60A TO-3P
  • Series:-
  • Mfr:Sanken Electric USA Inc.
  • Package:Bulk
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):300 V
  • Current - Average Rectified (Io) (per Diode):60A
  • Voltage - Forward (Vf) (Max) @ If:1.4 V @ 30 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):50 ns
  • Current - Reverse Leakage @ Vr:200 µA @ 300 V
  • Operating Temperature - Junction:-40°C ~ 150°C
  • Mounting Type:Through Hole
  • Package / Case:TO-3P-3, SC-65-3
  • Supplier Device Package:TO-3P
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for CTXS-4603S

CTXS-4603S

Diode Arrays Overview

The CTXS-4603S is a high-power fast recovery diode manufactured by Sanken Electric. It features a peak repetitive reverse voltage of 300 V and an average forward current rating of 60 A. The device achieves a maximum reverse recovery time of 50 ns, with a typical value of 32 ns. Forward voltage drop is specified at a maximum of 1.4 V when conducting 30 A. Thermal resistance from junction to case is 1.0 °C/W. The component operates within a junction temperature range of -40 to 150 °C.

Diode Arrays Feature Summary

  • Optimized lifetime control for high-speed switching applications
  • Reduced forward power loss through low forward voltage characteristics
  • High thermal performance enabled by low thermal resistance package design

Diode Arrays Applications

  • Large current secondary side rectifier circuits
  • DC-DC converter topologies

Diode Arrays Procurement Notes

Verify the specific datasheet revision against the manufacturer's official records before integration. Confirm that the TO-3P-3L package dimensions align with the target heatsink interface requirements. Ensure compliance with RoHS directives regarding lead treatment. Review absolute maximum ratings carefully to prevent exceeding surge current limits during operation.

Diode Arrays Selection Notes

Evaluate the thermal management strategy to maintain junction temperatures within the specified -40 to 150 °C range under expected load conditions. Consider the 50 ns reverse recovery time for compatibility with high-frequency switching requirements. Assess the 1.4 V forward voltage drop impact on overall system efficiency at rated currents.

Diode Arrays Part Context

This component belongs to Sanken Electric's high-power diode portfolio designed for robust industrial and power conversion environments. It utilizes a plastic epoxy encapsulation in a long-form round package. The device is intended for general purpose electronic equipment rather than aerospace or nuclear applications.

Diode Arrays Replacement Considerations

The datasheet explicitly marks this part as 'Not Recommended for New Designs'. Verify availability of alternative components from the manufacturer's current lineup that offer equivalent electrical specifications and package compatibility.

CTXS-4603SCTXS-4603S

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