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CYP15G0402DXB-BGXC is listed in the Telecom range at ChipApex. The manufacturer field lists Cypress Semiconductor Corp. Its product description is QUAD HOTLINK II RECEIVER. Review the specifications below when checking this part for your BOM.
The CYP15G0402DXB is a Quad HOTLink II SERDES manufactured by Cypress Semiconductor. It supports serial data rates from 195 to 1500 Mbps per channel, providing an aggregate throughput of 12 Gbps. The device operates on a single 3.3V supply with typical power consumption of 2.5W. It features four independent 10-bit channels with separate Clock and Data Recovery (CDR) for each channel. The package is a 256-ball thermally enhanced BGA measuring 27 x 27 mm.
Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm the specific suffix matches the required SMPTE compliance variant. Check for lead-free packaging status if environmental regulations apply. Ensure proper handling procedures are followed due to the BGA package type and moisture sensitivity level.
Select this component when high-speed serial connectivity is required for multiple parallel data streams. Consider the CYV15G0402DXB variant if SMPTE 259M and 292M pathological test compliance is mandatory. Evaluate system clocking requirements against the selectable input options. Assess thermal management needs given the 2.5W typical power dissipation in a compact BGA package.
This part belongs to the HOTLink II family of SERDES devices designed for high-performance telecommunications and video applications. It extends the capabilities of previous generations by supporting higher data rates up to 1500 Mbps while maintaining backward compatibility with standard HOTLink signaling protocols. The device integrates advanced framing and error detection features within a single chip.
Publicly confirmed substitute part numbers are not available in the provided documentation.
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