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CYUSB3064-BZXC is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC EZ-USB BRIDGE 2LANE 121BGA. Review the specifications below when checking this part for your BOM.
The CYUSB3064-BZXC is an EZ-USB™ CX3 MIPI CSI-2 to SuperSpeed USB bridge controller. It integrates a 5-Gbps USB 3.0 PHY compliant with PIPE 3.0 and supports up to two MIPI CSI-2 data lanes, each operating at 1 Gbps. The device features a fully accessible 32-bit ARM926EJ-S CPU running at 200 MHz with 512 KB of embedded SRAM. It provides serial connectivity via I2C (1 MHz), UART (4 Mbps), SPI (33 MHz), and I2S master interfaces. The component operates within a core voltage range of 1.7 V to 3.6 V and is housed in a 121-ball BGA package.
Verify the specific ordering suffix against the manufacturer's current product selector guide to confirm availability and revision status. Ensure that the design accounts for the independent power domains required for the core and I/O sections. Confirm that the PCB layout adheres to the thermal characteristics and EMI guidelines specified in the official datasheet for the BGA package.
Select this model when a two-lane MIPI CSI-2 input is sufficient for the application bandwidth requirements. The CYUSB3065 variant offers four lanes if higher throughput is needed. Ensure the host system supports USB 3.0 enumeration and that the firmware development environment utilizes the provided EZ-USB SDK for proper driver integration and configuration.
This component belongs to the EZ-USB™ CX3 family of bridge controllers designed to connect MIPI image sensors to USB hosts. It serves as a direct replacement for legacy bridge solutions requiring high-speed video transfer. The CX3 architecture simplifies design by integrating the USB PHY, MIPI receiver, and processing core into a single chip.
The CYUSB3065-BZXC is a compatible alternative within the same family that supports four MIPI CSI-2 lanes instead of two. Verify pin compatibility and firmware adaptability when considering cross-model substitution within the CX3 series.
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