CYW20736A1KML2GT

RF Transceiver ICS Overview

The CYW20736A1KML2GT is an RF System on a Chip (SoC) from Infineon Technologies, part of the AIROC series. It integrates Bluetooth Low Energy (BLE) and IEEE 802.15.4 capabilities within a single silicon component. The device features a 24 MHz Cortex-M3 processor, 60 kByte RAM, and operates within a temperature range of -30°C to 85°C. It is housed in a 32-QFN package with dimensions of 5x5 mm. The SoC supports Bluetooth v4.1 protocols at 2.4 GHz, offering data rates up to 1 Mbps and a transmit power of 4 dBm. Key electrical specifications include a receive current of 26.6 mA and a transmit current of 24 mA, powered by a 3.8 V supply.

RF Transceiver ICS Feature Summary

• Integrates Bluetooth Low Energy and IEEE 802.15.4 radio transceivers with an embedded MCU
• Utilizes a 24 MHz Cortex-M3 processor for efficient signal processing
• Supports standard serial communication interfaces including I2C, SPI, and UART

RF Transceiver ICS Applications

• Bluetooth Low Energy peripheral devices
• IEEE 802.15.4 sensor nodes
• Wireless remote control systems

RF Transceiver ICS Procurement Notes

Verify the specific ordering suffix to ensure compatibility with required packaging formats such as cut tape or reel quantities. Confirm that the selected variant meets the necessary humidity sensitivity level requirements for your assembly process. Cross-reference the manufacturer datasheet to validate the active status and availability of this specific part number before finalizing procurement plans.

RF Transceiver ICS Selection Notes

Select this component when a combined BLE and 802.15.4 solution is required in a compact form factor. The integrated Cortex-M3 core reduces external microcontroller dependencies. Ensure the design accommodates the 32-QFN exposed pad thermal requirements. Verify that the operating voltage and current consumption profiles align with the target application's power budget constraints.

RF Transceiver ICS Part Context

This model belongs to the CYW20736 family of AIROC wireless connectivity solutions. It represents a consolidation of radio and processing functions into a single chip architecture. The series is designed for low-power wireless applications requiring robust protocol support. The QFN-32 package provides a balance between pin count and board space efficiency for portable electronics.

RF Transceiver ICS Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.