Diode Arrays DD710N16KHPSA2 product image

DD710N16KHPSA2

  • Description:DIODE MOD GP 1600V 710A MOD
  • Series:-

SKU:cbe2c32bb8c8 Category: Brand:

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DD710N16KHPSA2 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is DIODE MOD GP 1600V 710A MOD. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for DD710N16KHPSA2

  • Description:DIODE MOD GP 1600V 710A MOD
  • Series:-
  • Mfr:Infineon Technologies
  • Package:Tray
  • Diode Configuration:1 Pair Series Connection
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):1600 V
  • Current - Average Rectified (Io) (per Diode):710A
  • Voltage - Forward (Vf) (Max) @ If:1.31 V @ 2500 A
  • Speed:Standard Recovery >500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:40 mA @ 1600 V
  • Operating Temperature - Junction:-40°C ~ 150°C
  • Mounting Type:Chassis Mount
  • Package / Case:Module
  • Supplier Device Package:Module
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for DD710N16KHPSA2

DD710N16KHPSA2

Diode Arrays Overview

The DD710N16KHPSA2 is a rectifier diode module from Infineon Technologies featuring pressure contact technology and an electrically insulated baseplate. It provides a repetitive peak reverse voltage of 1600 V and supports an average on-state current of 710 A at a case temperature of 100°C. The device exhibits a maximum threshold voltage of 0.75 V and a slope resistance of 0.145 mΩ. Thermal management is facilitated by a junction-to-case thermal resistance of 0.062 K/W per arm under DC conditions, with a maximum junction temperature rating of 150°C.

Diode Arrays Feature Summary

  • Pressure contact technology ensures high mechanical reliability and consistent electrical performance.
  • Electrically insulated baseplate enables direct mounting to grounded heatsinks without additional insulators.
  • Advanced medium power silicon technology optimizes conduction losses for industrial applications.

Diode Arrays Applications

  • Rectifiers for drive applications
  • Rectifiers for UPS systems
  • Battery chargers

Diode Arrays Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm exact configuration details. Confirm RoHS compliance status and lead times directly with authorized distributors or the manufacturer. Ensure proper handling procedures are followed due to the heavy weight and fragile nature of the ceramic insulation layer within the module structure.

Diode Arrays Selection Notes

Select this component when high surge current capability and robust mechanical connections are required. The insulated baseplate simplifies thermal interface design in high-voltage environments. Evaluate the thermal resistance values against your specific heatsink constraints to ensure the junction temperature remains within the 150°C limit during continuous operation.

Diode Arrays Part Context

This module belongs to the standard network diode series designed for high-power industrial conversion. It utilizes silicon pellet technology housed in an industry-standard package. The design focuses on balancing high current density with reliable long-term operation in demanding electrical environments.

Diode Arrays Replacement Considerations

Consult official replacement guides for cross-references. Verify pinout compatibility and thermal resistance equivalence before substituting.

Diode Arrays FAQ

What is the maximum non-repetitive peak reverse voltage?

The maximum non-repetitive peak reverse voltage (VRSM) is rated at 1700 V.

How does the module handle insulation testing?

It withstands an insulation test voltage of 3.6 kV RMS for one second at 50 Hz, providing basic insulation according to IEC 61140 Class 1.

What is the recommended mounting torque for electrical connections?

The recommended mounting torque for electrical connections is 12 Nm with a tolerance of ±10%.

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