DSEI2X31-12B

Diode Arrays Overview

The IXYS DSEI2X31-12B is a fast recovery rectifier diode housed in a screw-mount SOT-227B package. It features a dual anti-parallel configuration with a peak repetitive reverse voltage of 1.2 kV and a continuous forward current of 28 A per element. The device exhibits a maximum forward voltage of 2.55 V, a peak non-repetitive surge current of 210 A, and a reverse recovery time of 60 ns. Operating temperatures range from -40°C to +150°C.

Diode Arrays Feature Summary

• Dual anti-parallel configuration for bridge-less or center-tapped applications
• Fast recovery characteristics suitable for high-frequency switching
• Robust thermal performance via direct chassis mounting

Diode Arrays Applications

• High-power DC/DC converters
• Industrial motor drives
• Uninterruptible power supplies (UPS)

Diode Arrays Procurement Notes

Verify the specific suffix against official datasheets to confirm electrical tolerances and pinout compatibility. Ensure the procurement channel provides traceable documentation matching the manufacturer's specifications. Confirm that the component meets required environmental standards for the intended deployment environment.

Diode Arrays Selection Notes

Select this component for designs requiring high-voltage isolation and rapid switching speeds in heavy-duty environments. The SOT-227B form factor facilitates efficient heat dissipation through direct panel attachment. Evaluate thermal resistance requirements relative to the system's cooling infrastructure before integration.

Diode Arrays Part Context

This part belongs to the IXYS DSEI series of super-fast recovery diodes. These components are engineered for high-efficiency power conversion systems where low switching losses and high reliability are critical. The series supports demanding industrial and automotive power electronics applications.

Diode Arrays Replacement Considerations

Cross-reference with DSEI2X31-10B for similar electrical ratings within the same family. Verify mechanical dimensions and mounting hole patterns when substituting to ensure physical compatibility with existing heatsink assemblies.