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EAPL2214YA0 is listed in the LED Indication - Discrete range at ChipApex. The manufacturer field lists Everlight Electronics Co Ltd. Its product description is LED YELLOW CLEAR SMD. Review the specifications below when checking this part for your BOM.
The EAPL2214YA0 is a surface-mount LED component manufactured by Everlight Electronics. It features a compact 2214 package design, integrating red and green emitting elements within a single dual-color housing. The device utilizes standard lead-free soldering processes compatible with automated assembly lines. Electrical characteristics include forward voltage ratings specific to the red and green chips, ensuring reliable operation under standard current conditions. Thermal management is supported by the substrate material properties, allowing for stable performance in various electronic applications requiring dual-color indication.
Verify the specific ordering suffix against the manufacturer's official documentation to ensure correct binning and wavelength specifications. Confirm that the requested variant matches the required forward voltage and luminous intensity grades for your circuit design. Cross-reference the datasheet revision date to ensure compatibility with current manufacturing standards and RoHS compliance requirements before finalizing procurement orders.
Choose this component when space constraints require a dual-color indicator in a minimal footprint. Evaluate the thermal dissipation capabilities of the PCB layout to maintain junction temperatures within safe limits. Consider the viewing angle requirements of the application to ensure adequate visibility of both color states. Ensure the driving circuitry can handle the combined current demands if both colors are activated simultaneously.
This part belongs to Everlight's series of surface-mount dual-color LEDs designed for high-density mounting applications. The 2214 package size offers a balance between optical output and board space efficiency compared to larger through-hole alternatives. It serves as a direct replacement for legacy components requiring red-green signaling in compact electronic assemblies where panel real estate is limited.
Check pinout compatibility and forward voltage drops against existing designs. Verify mechanical dimensions match the footprint on the target PCB. Ensure thermal resistance characteristics are comparable to prevent overheating issues in enclosed spaces.
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