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EPC8QI100N is listed in the Configuration PROMs For FPGAs range at ChipApex. The manufacturer field lists Altera. Its product description is IC CONFIG DEVICE 8MBIT 100QFP. Review the specifications below when checking this part for your BOM.
The EPC8QI100N is a non-volatile configuration memory device manufactured by Altera, designed for use with Field-Programmable Gate Arrays (FPGAs). It features a storage capacity of 8 Mbit and operates within a supply voltage range of 3 V to 3.6 V. The component supports system-in-programmability, allowing for in-system updates. It is housed in a 100-pin PQFP package with dimensions of 20x14 mm and is rated for an industrial operating temperature range from -40°C to +85°C.
Verify component authenticity through authorized distributors or official manufacturer channels due to end-of-life status. Confirm RoHS compliance details via current datasheets. Check for moisture sensitivity handling requirements prior to soldering. Validate package integrity against the 100-PQFP specification before integration into production workflows.
Select this component when an 8 Mbit configuration capacity is required for compatible Altera FPGAs. Ensure the design accommodates the 100-pin PQFP footprint and 3.3 V nominal supply. Consider the industrial temperature range if the application environment exceeds standard commercial limits. Verify compatibility with specific FPGA families supported by the EPC series.
The EPC8QI100N belongs to the EPC family of configuration devices from Altera. These components serve as primary storage for FPGA bitstreams. The 'QI' suffix typically denotes the package type and temperature grade. This part represents a specific capacity tier within the broader EPC product line, bridging lower density options and higher capacity variants like the EPC16.
Public documentation indicates this part is discontinued. Potential substitutes include other EPC series members such as EPC8QC100N or EPC16QC100N, provided pinout and capacity requirements align. Verify electrical characteristics and package dimensions before substitution.
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