FET, MOSFET Arrays G170P02D32 product image

G170P02D32

$0.57
  • Description:MOSFET 2P-CH 20V 20A 8DFN
  • Series:-

SKU:2ad3fe76a479 Category: Brand:

  
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G170P02D32 is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists Goford Semiconductor. Its product description is MOSFET 2P-CH 20V 20A 8DFN. Review the specifications below when checking this part for your BOM.

FET, MOSFET Arrays specifications for G170P02D32

  • Description:MOSFET 2P-CH 20V 20A 8DFN
  • Series:-
  • Mfr:Goford Semiconductor
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • Technology:MOSFET (Metal Oxide)
  • Configuration:2 P-Channel
  • FET Feature:-
  • Drain to Source Voltage (Vdss):20V
  • Current - Continuous Drain (Id) @ 25°C:20A (Tc)
  • Rds On (Max) @ Id, Vgs:21mOhm @ 6A, 4.5V
  • Vgs(th) (Max) @ Id:1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:30nC @ 10V
  • Input Capacitance (Ciss) (Max) @ Vds:2193pF @ 10V
  • Power - Max:15W (Tc)
  • Operating Temperature:-55°C ~ 150°C (TJ)
  • Mounting Type:Surface Mount
  • Package / Case:8-PowerVDFN
  • Supplier Device Package:8-DFN (3.15x3.05) Dual
  • Grade:-
  • Qualification:-

FET, MOSFET Arrays datasheet and documents for G170P02D32

G170P02D32

FET, MOSFET Arrays Overview

The G170P02D32 is a dual P-channel enhancement mode power MOSFET manufactured by Goford Semiconductor. It utilizes advanced trench technology to achieve low on-resistance and gate charge. The device features a -20V drain-source voltage rating and supports a continuous drain current of -20A at 25°C case temperature. On-resistance is specified as less than 21mΩ at VGS=-4.5V and less than 27mΩ at VGS=-2.5V. It is housed in a DFN3X3-8L package with a junction-to-case thermal resistance of 8.3°C/W.

FET, MOSFET Arrays Feature Summary

  • Dual configuration providing two identical low-side and high-side switches within a single compact package.
  • Advanced trench technology designed to deliver excellent on-resistance characteristics and low gate charge for efficient switching.
  • 100% avalanche tested to ensure robustness against inductive load switching events.

FET, MOSFET Arrays Applications

  • Power switch applications
  • DC/DC converters

FET, MOSFET Arrays Procurement Notes

Verify the specific ordering suffix and packaging quantity, which is listed as 5000 pieces per reel. Confirm that the component meets RoHS compliance requirements for your target market. Ensure the DFN3X3-8L footprint matches your PCB design constraints. Check for any specific handling instructions related to moisture sensitivity level if applicable.

FET, MOSFET Arrays Selection Notes

Select this component when a dual P-channel MOSFET solution is required for space-constrained designs. The DFN3X3-8L package offers a small footprint suitable for high-density layouts. Consider the thermal resistance values for heat dissipation planning. Verify that the gate drive voltage levels align with the specified RDS(on) thresholds for optimal performance.

FET, MOSFET Arrays Part Context

This part belongs to Goford Semiconductor's lineup of dual power MOSFETs. These devices are engineered for applications requiring synchronized or complementary switching actions in a minimal area. The dual structure simplifies circuit design by integrating matched pairs into one unit.

FET, MOSFET Arrays Replacement Considerations

No public confirmed substitute part numbers are available in the provided documentation.

FET, MOSFET Arrays FAQ

What is the maximum pulsed drain current for the G170P02D32?

The maximum pulsed drain current (IDM) is rated at -80 A.

Is the G170P02D32 avalanche rated?

Yes, the device is 100% avalanche tested.

What is the package type for this component?

The G170P02D32 is packaged in a DFN3X3-8L Dual configuration.

G170P02D32G170P02D32
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