Diode Arrays HFA140MD60C product image

HFA140MD60C

$44.00
  • Description:DIODE MODULE GP 600V 99A TO244AB
  • Series:HEXFRED®

SKU:44c8260b434f Category: Brand:

  
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HFA140MD60C is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Vishay General Semiconductor - Diodes Division. Its product description is DIODE MODULE GP 600V 99A TO244AB. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for HFA140MD60C

  • Description:DIODE MODULE GP 600V 99A TO244AB
  • Series:HEXFRED®
  • Mfr:Vishay General Semiconductor - Diodes Division
  • Package:Bulk
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Standard
  • Voltage - DC Reverse (Vr) (Max):600 V
  • Current - Average Rectified (Io) (per Diode):99A (DC)
  • Voltage - Forward (Vf) (Max) @ If:1.7 V @ 70 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):140 ns
  • Current - Reverse Leakage @ Vr:15 µA @ 600 V
  • Operating Temperature - Junction:-
  • Mounting Type:Chassis Mount
  • Package / Case:TO-244AB
  • Supplier Device Package:TO-244AB
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for HFA140MD60C

HFA140MD60C

Diode Arrays Overview

The HFA140MD60C is a HEXFRED ultrafast, soft recovery diode module in an isolated TO-244AB package. It features two series-connected elements with a center-tapped cathode configuration. The device supports a maximum repetitive reverse voltage of 600 V and a continuous forward current of 99 A at 25°C case temperature. Key electrical characteristics include a typical reverse recovery time of 35 ns, a peak reverse recovery current of 8.0 A, and a reverse recovery charge of 360 nC.

Diode Arrays Feature Summary

  • Ultrafast soft recovery design minimizes switching losses and reduces electromagnetic interference (EMI) and radio frequency interference (RFI).
  • Extensive characterization of recovery parameters across varying currents, temperatures, and di/dt simplifies loss calculations for operating conditions.
  • Soft recovery characteristic eliminates the need for snubber circuits in most high-frequency applications.

Diode Arrays Applications

  • High-frequency power conditioning systems
  • Power converters
  • Motor drives

Diode Arrays Procurement Notes

Verify the specific manufacturer origin, as this component was originally developed by International Rectifier and is now distributed by Vishay General Semiconductor. Confirm that the datasheet revision PD-40009 rev. A matches your engineering requirements. Ensure thermal interface materials are compatible with the specified mounting torque limits to maintain optimal junction-to-case thermal resistance.

Diode Arrays Selection Notes

Select this module when minimizing switching losses is critical in high-frequency topologies. The soft recovery profile allows for reduced snubbing requirements compared to standard fast recovery diodes. Evaluate the thermal impedance curves against your specific duty cycle and ambient cooling conditions to ensure the junction temperature remains within the -55 to +150 °C operating range during peak load scenarios.

Diode Arrays Part Context

This component belongs to the HEXFRED family of ultrafast recovery diodes designed for high-efficiency power electronics. It utilizes silicon technology housed in a flange-mount TO-244AB isolated package. The dual-element, center-tap configuration facilitates use in bridge rectifier or half-bridge applications requiring high current handling capabilities.

Diode Arrays Replacement Considerations

HFA140NJ60C

Diode Arrays FAQ

What is the typical reverse recovery time for the HFA140MD60C?

The typical reverse recovery time (trr) is 35 ns under test conditions of IF = 1.0A, dif/dt = 200A/µs, and VR = 30V at TJ = 25°C.

How does the soft recovery feature benefit circuit design?

The soft recovery characteristic eliminates the need for snubber circuits in most applications, thereby reducing component count, cost, and potential sources of EMI/RFI.

What is the maximum power dissipation at a case temperature of 100°C?

The maximum power dissipation decreases to 91 W when the case temperature is maintained at 100°C.

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