SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The HP2FSBFSBG100BD is an RF cable assembly manufactured by Amphenol ICC (Commercial Products). It belongs to the RF Cable Assemblies product category and is supplied in bulk packaging. This component serves as a pre-assembled interconnect solution designed for radio frequency signal transmission within electronic systems.
Verify the specific connector types, cable length, impedance, and frequency range against project requirements before procurement. Confirm that the bulk packaging format aligns with your assembly line handling capabilities. Ensure compatibility with mating connectors on the target PCB or chassis. Cross-reference the manufacturer's datasheet for environmental ratings and material specifications to guarantee suitability for the intended operating conditions.
Select this component when a fixed-length RF cable assembly is required rather than discrete components. Consider the bulk packaging option if high-volume manual assembly is planned. Evaluate the specific RF performance characteristics and physical dimensions to ensure they fit within the system enclosure constraints. Verify that the connector interfaces match the design schematic.
Amphenol ICC (Commercial Products) is a division of Amphenol Corporation specializing in interconnect solutions for commercial markets. The company provides a wide range of connectors, cable assemblies, and accessories. This part falls under their broader portfolio of RF and microwave products used in various consumer and industrial applications.
No publicly confirmed substitute part numbers are available in the provided documentation. Consult the manufacturer for potential alternatives or obsolescence management strategies.
Las Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More