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HS24230 is listed in the Single Diodes range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is DIODE SCHOTTKY 30V 240A HALF-PAK. Review the specifications below when checking this part for your BOM.
The HS24230 is a 240 Amp Schottky Rectifier manufactured by Microsemi Corporation. It features a maximum repetitive reverse voltage of 30 V and an average forward rectified current of 240 A. The device utilizes a Half-Pak package design, which integrates the diode die into a robust metal housing for efficient thermal management. This component is engineered for high-current applications requiring low forward voltage drop and high reliability.
Verify the specific suffix designation against the manufacturer's official datasheet to confirm exact electrical tolerances and packaging variations. Confirm RoHS compliance status as historical Microsemi products may vary in regulatory adherence depending on production date. Ensure the supplier provides traceable documentation matching the original Microsemi part number to avoid counterfeit components.
Select this component when a 30 V reverse voltage rating and 240 A continuous current capacity are required. The Half-Pak form factor is suitable for applications needing direct mounting to heat sinks for optimal thermal performance. Consider the low forward voltage characteristic for minimizing conduction losses in high-efficiency power conversion designs compared to standard PN junction rectifiers.
The HS24230 belongs to the HS24 series of high-power Schottky rectifiers from Microsemi. This family includes variants with different reverse voltage ratings, such as the HS24045 and HS24135, all sharing the same 240 A current handling capability. These devices are designed for demanding industrial and commercial power electronics environments requiring high reliability and ruggedness.
Direct replacements within the same series include HS24045 (45V), HS24135 (135V), and HS24380 (380V), provided the system voltage allows for higher reverse ratings. Verify that the alternative part maintains the Half-Pak package dimensions and thermal characteristics to ensure compatibility with existing PCB layouts and cooling solutions.
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