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IRF6633ATRPBF is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is MOSFET N-CH 20V 16A DIRECTFET. Review the specifications below when checking this part for your BOM.
The IRF6633ATRPBF is an N-Channel Power MOSFET from the HEXFET® series, utilizing DirectFET™ MP packaging. It features a Drain-to-Source Voltage (Vdss) of 20 V and a continuous drain current (Id) of 16 A at ambient temperature or 59 A at case temperature. The maximum on-state resistance (Rds(on)) is 5.6 mΩ at 10 V gate drive and 9.4 mΩ at 4.5 V. Total gate charge (Qg) is typically 11 nC with a maximum of 17 nC at 4.5 V. The device supports dual-sided cooling, operates within a junction temperature range of -40°C to +150°C, and has a power dissipation rating of 2.3 W at ambient or 89 W at case temperature.
Verify component authenticity through authorized distribution channels. Confirm package marking matches official datasheet specifications. Check for lead-free compliance indicators on the reel label. Ensure storage conditions maintain moisture sensitivity level integrity prior to soldering. Review manufacturer obsolescence notices for long-term supply availability.
Evaluate thermal management requirements based on application duty cycle and cooling method. Compare gate charge parameters against available driver capabilities to ensure efficient switching. Verify voltage ratings exceed peak circuit transients. Assess package suitability for PCB layout constraints and mechanical height limitations.
This component belongs to the Infineon HEXFET® family designed for high-frequency power conversion. The DirectFET™ MP variant offers enhanced thermal performance compared to standard packages while maintaining a small outline compatible with existing manufacturing equipment. It targets applications requiring high current density in compact form factors.
IRF6633TRPBF
The absolute maximum rating for gate-to-source voltage is ±20 V.
The DirectFET™ MP package allows for dual-sided cooling, enabling heat dissipation from both the top drain surface and the bottom substrate to improve thermal resistance.
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