Memory IC IS42SM16200C-75BLI product image

IS42SM16200C-75BLI

  • Description:IC DRAM 32MBIT PARALLEL 54TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray

SKU:9c041105f312 Category: Brand:

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IS42SM16200C-75BLI is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC DRAM 32MBIT PARALLEL 54TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS42SM16200C-75BLI

  • Description:IC DRAM 32MBIT PARALLEL 54TFBGA
  • Series:-
  • Mfr:ISSI, Integrated Silicon Solution Inc
  • Package:Tray
  • Memory Type:Volatile
  • Memory Format:DRAM
  • Technology:SDRAM - Mobile
  • Memory Size:32Mbit
  • Memory Organization:2M x 16
  • Memory Interface:Parallel
  • Clock Frequency:133 MHz
  • Write Cycle Time - Word, Page:-
  • Voltage - Supply:3V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:54-TFBGA
  • Supplier Device Package:54-TFBGA (8x8)
  • Access Time:6 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for IS42SM16200C-75BLI

IS42SM16200C-75BLI

Memory IC Overview

The IS42SM16200C-75BLI is a low-power synchronous DRAM manufactured by ISSI. It provides a storage capacity of 32 Mbit, organized as 2M x 16 bits across two internal banks. The device operates with a maximum clock frequency of 133 MHz and features an access time of 6 ns. It utilizes a parallel interface within a 54-TFBGA package measuring 8x8 mm. Power supply requirements range from 2.7 V to 3.6 V for both VDD and VDDQ. The component supports an industrial operating temperature range of -40°C to +85°C.

Memory IC Feature Summary

  • Supports programmable burst lengths including sequential and interleaved types, alongside CAS latency settings of 2 or 3 clocks.
  • Includes specialized power management functions such as Partial Array Self Refresh (PASR) and Temperature Compensated Self Refresh (TCSR).
  • Features deep power down mode and driver strength control options to optimize energy consumption during various operational states.

Memory IC Applications

  • Mobile handheld devices requiring compact memory solutions
  • Portable consumer electronics utilizing SDRAM interfaces
  • Industrial embedded systems operating in extended temperature ranges

Memory IC Procurement Notes

Verify the specific suffix BLI against the manufacturer's current datasheet to confirm pinout and packaging details. Confirm RoHS compliance status and moisture sensitivity level prior to integration. Check for end-of-life notifications or obsolescence warnings directly from ISSI documentation before finalizing procurement plans.

Memory IC Selection Notes

Select this component when a 32 Mbit density with a 16-bit data bus width is required. Ensure the design accommodates the 54-ball TFBGA footprint and the specified voltage levels. Verify that the system controller supports the necessary SDRAM initialization sequences and command protocols defined in the specification.

Memory IC Part Context

This part belongs to the IS42SM16200 series of low-power mobile SDRAMs. It shares architectural similarities with the IS42RM and IS42VM variants, differing primarily in environmental ratings and specific feature sets. The series targets applications demanding high bandwidth within strict power constraints.

Memory IC Replacement Considerations

Consult official ISSI documentation for verified substitute part numbers. Cross-referencing requires matching organization, speed grade, and package type.

IS42SM16200C-75BLIIS42SM16200C-75BLI

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