IS61NLP102418B-200B3L-TR

$11.07

Description：IC SRAM 18MBIT PARALLEL 165TFBGA
Series：-
Mfr：ISSI, Integrated Silicon Solution Inc
Package：Tape & Reel (TR)

SKU:118d16cebaa6 Category: Memory IC Brand: ISSI, Integrated Silicon Solution Inc

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Product introduction

IS61NLP102418B-200B3L-TR is listed in the Memory IC range at ChipApex. The manufacturer field lists ISSI, Integrated Silicon Solution Inc. Its product description is IC SRAM 18MBIT PARALLEL 165TFBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for IS61NLP102418B-200B3L-TR

Description：IC SRAM 18MBIT PARALLEL 165TFBGA
Series：-
Mfr：ISSI, Integrated Silicon Solution Inc
Package：Tape & Reel (TR)
Memory Type：Volatile
Memory Format：SRAM
Technology：SRAM - Synchronous, SDR
Memory Size：18Mbit
Memory Organization：1M x 18
Memory Interface：Parallel
Clock Frequency：200 MHz
Write Cycle Time - Word, Page：-
Voltage - Supply：3.135V ~ 3.465V
Operating Temperature：0°C ~ 70°C (TA)
Mounting Type：Surface Mount
Package / Case：165-TBGA
Supplier Device Package：165-TFBGA (13x15)
Access Time：3 ns

Memory IC datasheet and documents for IS61NLP102418B-200B3L-TR

IS61NLP102418B-200B3L-TR

Memory IC Overview

The IS61NLP102418B-200B3L-TR is a synchronous static random-access memory (SRAM) device manufactured by ISSI. It features an 18 Mbit storage capacity organized as 1 Megabit by 18 bits. The component supports a maximum clock frequency of 200 MHz with a pipeline architecture and no-wait operation. Access time is specified at 3 ns. Operating voltage ranges from 2.5 V to 3.3 V for I/O, housed in a 165-ball FBGA package suitable for surface mount technology.

Memory IC Feature Summary

Pipeline architecture enabling no-wait synchronous data transfer operations
High-speed parallel interface supporting up to 200 MHz clock frequencies
Dual-voltage capability accommodating 2.5 V and 3.3 V I/O levels

Memory IC Applications

High-performance embedded systems requiring fast data buffering
Network infrastructure equipment utilizing synchronous memory interfaces
Industrial control applications needing reliable volatile storage

Memory IC Procurement Notes

Verify the specific suffix B3L against official datasheets to confirm package type and temperature range compatibility. Ensure supply chain sources provide valid RoHS compliance documentation. Confirm moisture sensitivity level handling requirements during assembly. Validate that the reel packaging matches production line specifications. Cross-reference manufacturer part numbers to avoid counterfeit components.

Memory IC Selection Notes

Select this component when system design demands high-bandwidth synchronous memory with low latency. The 1M x 18 organization suits applications requiring wide data paths without external parity logic. Consider the 165-ball FBGA footprint for board space constraints. Verify power supply stability within the 2.5 V to 3.3 V range for optimal signal integrity.

Memory IC Part Context

This device belongs to the IS61NLP102418B series of synchronous SRAMs. It shares architectural similarities with other ISSI pipeline memory products but differs in density and pinout configurations. The series targets applications requiring deterministic access times and high throughput compared to asynchronous alternatives.