M2S060-FCSG325I

Soc System On Chip Overview

The M2S060-FCSG325I is a SmartFusion® 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 56,520-logic element FPGA fabric in a 325-ball FCBGA package. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 1.2V core supply voltage. Key features include embedded non-volatile memory, high-speed serial interfaces, and support for industrial-grade reliability.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 processor with 56,520 logic elements
• Industrial temperature grade (-40°C to 100°C)
• 325-ball Fine-pitch Ball Grid Array (FCBGA) package

Soc System On Chip Applications

• Industrial automation control systems
• Secure communication gateways
• Embedded processing with real-time FPGA acceleration

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to 100°C). Confirm the package type is FCBGA-325. Ensure compatibility with SmartTime timing analysis tools for the selected speed grade.

Soc System On Chip Selection Notes

Select this model for applications requiring both hard processor system capabilities and reconfigurable logic in harsh environments. Compare against M2S050 variants if lower density suffices. Verify power supply requirements for VDD (1.2V) and VPP (2.5V or 3.3V range).

Soc System On Chip Part Context

This component belongs to the SmartFusion® 2 family, which combines flash-based FPGA technology with an integrated microcontroller subsystem. It is designed for security-sensitive and high-reliability applications, offering deterministic boot times and hardware-level protection mechanisms.

Soc System On Chip Replacement Considerations

M2S060TS-1FCSG325I: Same density but includes additional timestamp/security features. M2S050T-1FCSG325I: Lower logic density (approx. 50K LEs). M2S090TS-1FCSG325I: Higher logic density (approx. 90K LEs).