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MA3S13300L is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Panasonic Electronic Components. Its product description is DIODE ARRAY GP 80V 100MA SSMINI3. Review the specifications below when checking this part for your BOM.
The MA3S13300L is a silicon epitaxial planar switching diode manufactured by Panasonic Industry. It contains two isolated elements connected in series within an SSMini3-F2 (SC-89, SOT-490) surface-mount package. The device supports a maximum reverse voltage of 80 V and a single forward current of 100 mA DC. Key electrical parameters include a forward voltage of 1.2 V at 100 mA, a reverse leakage current of 100 nA at 75 V, and a reverse recovery time of 150 ns. Terminal capacitance ranges from 3.0 pF to 5.5 pF depending on the pin configuration.
Verify component status before design finalization as this part is classified under maintenance or discontinued lifecycle stages. Consult official manufacturer channels for the most up-to-date Product Standards and availability information. Ensure compliance with RoHS Directive requirements during procurement and integration processes.
Select this component for applications requiring compact surface-mount solutions with internal series diode configurations. Verify that the 80 V reverse voltage and 100 mA forward current ratings align with circuit demands. Consider the 150 ns reverse recovery time for switching speed requirements and ensure thermal management accommodates the 150°C maximum junction temperature.
This component belongs to the MA3S133 series of small-signal switching diodes produced by Panasonic Industry. It utilizes the EIAJ SC-81 standard footprint, also identified as SSMini3-F2. The series is engineered for general-purpose electronics, offering a balance of low forward voltage drop and fast switching characteristics suitable for standard digital and analog signal processing tasks.
Consult official documentation for confirmed substitute part numbers. Cross-referencing should verify identical pinout, voltage ratings, and package dimensions to ensure mechanical and electrical compatibility without redesigning the host circuit board.
The two isolated elements within the package are connected in series.
Terminal capacitance is 5.5 pF between pins 2 and 3, and 3.0 pF between pins 1 and 3, measured at 1 MHz.
The marking symbol printed on the component is MP.
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