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MA4E2502L-1246 is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE SCHOTTKY 5V 50MW DIE. Review the specifications below when checking this part for your BOM.
The MA4E2502L-1246 is a low barrier silicon Schottky diode from the MACOM Surmount series, designed for microwave circuits up to Ku band frequencies. It utilizes the Heterolithic Microwave Integrated Circuit (HMIC) process, embedding silicon pedestals in a glass dielectric to achieve extremely low parasitic capacitance and inductance without wirebonds. Key electrical specifications at +25°C include a maximum forward voltage of 330 mV at 1 mA, a minimum breakdown voltage of 3 V at 10 µA, and a typical junction capacitance of 0.10 pF at 0 V. The device supports an operating temperature range of -40°C to +125°C and features Class 0 HBM ESD protection.
Verify the specific ordering suffix when sourcing components. The base model MA4E2502x-1246 is available as individual dies in carriers or on wafers. Bulk quantities are typically supplied via MADS-002502-1246xP reels or MADS-002502-1246xPW waffle packs. Confirm that the 'L' designation corresponds to the low barrier variant required for the circuit design.
Select the MA4E2502L-1246 specifically for applications requiring the lowest forward voltage drop among the series options. This low barrier configuration is optimal for low-power detection and mixing tasks where sensitivity is critical. Ensure the circuit layout accommodates the 1246 case style dimensions and utilizes appropriate soldering methods for the bottom mounting pads.
This component belongs to the MA4E2502 Series, which includes medium barrier (MA4E2502M) and high barrier (MA4E2502H) variants. All models share the same HMIC fabrication process and physical outline but differ in their electrical characteristics, specifically forward voltage and dynamic resistance, to suit different power and frequency requirements.
The datasheet indicates these devices facilitate the direct replacement of more fragile beam lead diodes. Specific equivalent part numbers for legacy beam lead components are not provided in the documentation; engineers must verify compatibility based on parasitic parameters and mounting pad alignment.
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