Single FETs, MOSFETs MCU30N02-TP product image

MCU30N02-TP

$0.58
  • Description:MOSFET N-CH 20V 30A DPAK
  • Series:-
  • Mfr:MCC (Micro Commercial Components)
  • Package:Tape & Reel (TR),Cut Tape (CT)

SKU:6b0980f535af Category: Brand:

  
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MCU30N02-TP is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is MOSFET N-CH 20V 30A DPAK. Review the specifications below when checking this part for your BOM.

Single FETs, MOSFETs specifications for MCU30N02-TP

  • Description:MOSFET N-CH 20V 30A DPAK
  • Series:-
  • Mfr:MCC (Micro Commercial Components)
  • Package:Tape & Reel (TR),Cut Tape (CT)
  • FET Type:N-Channel
  • Technology:MOSFET (Metal Oxide)
  • Drain to Source Voltage (Vdss):20 V
  • Current - Continuous Drain (Id) @ 25°C:30A (Tc)
  • Drive Voltage (Max Rds On, Min Rds On):1.8V, 4.5V
  • Rds On (Max) @ Id, Vgs:7mOhm @ 15A, 4.5V
  • Vgs(th) (Max) @ Id:1V @ 250µA
  • Gate Charge (Qg) (Max) @ Vgs:29 nC @ 4.5 V
  • Vgs (Max):±10V
  • Input Capacitance (Ciss) (Max) @ Vds:1700 pF @ 10 V
  • FET Feature:-
  • Power Dissipation (Max):30W (Tc)
  • Operating Temperature:-55°C ~ 175°C (TJ)
  • Grade:-
  • Qualification:-
  • Mounting Type:Surface Mount
  • Supplier Device Package:DPAK
  • Package / Case:TO-252-3, DPAK (2 Leads + Tab), SC-63

Single FETs, MOSFETs datasheet and documents for MCU30N02-TP

MCU30N02-TP

Single FETs, MOSFETs Overview

The MCU30N02-TP is an N-channel enhancement mode MOSFET manufactured by Micro Commercial Components (MCC). It utilizes Trench Power LV technology and features a DPAK surface-mount package. Key electrical parameters include a drain-source voltage of 30V, a continuous drain current of 30A at 25°C, and a maximum pulsed drain current of 120A. The device exhibits a typical on-resistance of 5.8 milliohms at VGS=4.5V and ID=15A. It supports an operating junction temperature range from -55°C to +175°C with a thermal resistance of 5°C/W junction-to-case.

Single FETs, MOSFETs Feature Summary

  • Trench Power LV MOSFET technology for high-density cell design
  • Low RDS(on) achieved through optimized cell architecture
  • Moisture Sensitivity Level 1 classification
  • Halogen-free green device compliant with UL 94 V-0 flammability rating

Single FETs, MOSFETs Applications

  • DC-DC converters
  • Power switching applications
  • Motor control circuits

Single FETs, MOSFETs Procurement Notes

Verify the authenticity of the MCU30N02-TP component by purchasing exclusively from MCC or their authorized distributors to avoid counterfeit parts. Ensure the ordering suffix matches the required tape and reel quantity of 2500 pieces per reel. Confirm RoHS compliance status and check for any recent product change notices regarding manufacturing sites or specifications before finalizing procurement.

Single FETs, MOSFETs Selection Notes

Select the MCU30N02-TP when a low on-resistance N-channel MOSFET in a DPAK package is required for power management designs. Consider its 30V breakdown voltage and 30A continuous current capability for appropriate load handling. Evaluate the thermal performance using the specified junction-to-case thermal resistance for heat dissipation planning within the target application environment.

Single FETs, MOSFETs Part Context

This component belongs to the MCU series of N-channel MOSFETs produced by Micro Commercial Components. It is designed as a low-voltage power switch utilizing trench technology to minimize conduction losses. The part is intended for general-purpose power switching tasks where efficient thermal management and compact surface-mount packaging are necessary for circuit board integration.

Single FETs, MOSFETs Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.

Single FETs, MOSFETs FAQ

What is the maximum pulsed drain current for the MCU30N02-TP?

The maximum pulsed drain current is 120A.

Does the MCU30N02-TP meet RoHS standards?

Yes, the 'P' suffix designates that the device is RoHS compliant.

What is the thermal resistance from junction to case?

The thermal resistance from junction to case is 5°C/W.

MCU30N02-TPMCU30N02-TP
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