OSD3358-512M-BCB

Microcontrollers, Microprocessor, FPGA Modules Overview

The OSD3358-512M-BCB is a System-in-Package (SiP) module manufactured by Octavo Systems. It integrates an ARM Cortex-A8 processor, DDR3 memory, and a power management unit within a single BGA package. This design consolidates the core computing elements to reduce external component count and PCB footprint. The module supports standard industrial communication interfaces and is engineered for applications requiring high integration density and efficient power management in compact form factors.

Microcontrollers, Microprocessor, FPGA Modules Feature Summary

• Integrates AM335x processor, DDR3 memory, and TPS65217B PMIC
• System-in-Package (SiP) architecture reduces board space
• Supports CAN, I2C, SPI, UART, and USB interfaces

Microcontrollers, Microprocessor, FPGA Modules Applications

• Industrial automation controllers
• Portable medical devices
• Smart home gateways

Microcontrollers, Microprocessor, FPGA Modules Part Context

This part belongs to the OSD335x family of SiP modules from Octavo Systems. These modules are designed to replace discrete SoC and PMIC combinations, offering a pre-validated solution that simplifies hardware design and improves signal integrity through internal high-speed routing.

Microcontrollers, Microprocessor, FPGA Modules Replacement Considerations

Direct pin-to-pin replacements may not exist due to the proprietary SiP integration. Designers should evaluate alternative Octavo SiP modules or discrete AM335x solutions based on available PCB real estate and power requirements.