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P82B96TD/S410,118 is listed in the Signal Buffers, Repeaters, Splitters range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC REDRIVER I2C 2CH 400KHZ 8SO. Review the specifications below when checking this part for your BOM.
The P82B96TD/S410,118 is a dual bidirectional bus buffer designed for I²C and SMBus applications. It provides two independent channels to extend bus distance or increase fan-out capability. The device operates with a supply voltage range of 1.65V to 5.5V, ensuring compatibility with various logic families. It supports data rates up to 3.4MHz in Fast Mode Plus (Fm+) and includes built-in glitch filtering to maintain signal integrity on noisy lines. The component is housed in an SO8 surface-mount package.
Verify the specific ordering code suffix against manufacturer databases to confirm availability status. The provided model number may represent a specific tape-and-reel configuration or regional variant. Cross-reference the full part number with official NXP documentation to ensure compliance with current RoHS and REACH standards before procurement.
Select this component when dual isolated channels are required for I²C expansion. Ensure the operating voltage matches the lowest voltage rail in the system. Consider the SO8 package constraints for PCB layout. Verify that the bus capacitance requirements fall within the device's specified limits for reliable operation at the desired clock frequency.
This part belongs to the P82B96 family of bus buffers from NXP Semiconductors. It serves as a solution for extending I²C bus distances and increasing drive capability. The family includes variants with different packaging options such as TSSOP8. These devices are commonly used in consumer electronics, industrial automation, and automotive applications requiring robust bus communication.
Check for direct pin-compatible alternatives within the same product family. Verify electrical specifications match exactly, particularly supply voltage ranges and data rate capabilities. Ensure package dimensions and thermal characteristics are compatible with existing board layouts.
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