QS74FCT2373ZQCTQ

Latches Overview

The QS74FCT2373ZQCTQ is an octal transparent latch manufactured by IDT. It features eight D-type flip-flops with 3-state outputs, designed for bus-oriented applications. The device operates within the FCT series logic family and utilizes CMOS technology to provide high-speed performance with low power consumption. It is housed in a 20-pin SSOP package, suitable for temporary data storage and memory address latching in digital systems.

Latches Feature Summary

• Octal configuration with three-state outputs for efficient bus management
• Transparent latch operation allowing direct data passage when enabled
• CMOS technology implementation for reduced power consumption

Latches Applications

• Bus oriented applications requiring temporary data storage
• Memory address latching in computer systems
• I/O port implementations in embedded controllers

Latches Procurement Notes

Verify the specific suffix ZQCTQ against official IDT documentation to confirm package type and temperature range. Ensure compatibility with existing board layouts for 20-pin SSOP footprints. Cross-reference RoHS compliance status as indicated in current datasheets before finalizing procurement orders.

Latches Selection Notes

Select this component for designs requiring octal latching with tri-state control. Consider the 20-pin SSOP package constraints for PCB space. Evaluate speed requirements against the FCT series specifications to ensure adequate timing margins for the target system clock frequencies.

Latches Part Context

This part belongs to the IDT FCT (Fast CMOS) logic family, which serves as a high-speed replacement for older ABT functions. The FCT series is characterized by balanced output drivers and reduced switching noise, making it suitable for demanding digital logic applications requiring reliable data retention.

Latches Replacement Considerations

Check for direct pin-compatible alternatives within the IDT 74FCT2373 line. Verify that substitute parts maintain the same 3-state output characteristics and SSOP packaging dimensions to ensure seamless integration without redesigning the host circuit board.