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RM322-023-222-2000 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is RM322-023-222-2000. Review the specifications below when checking this part for your BOM.
The AirBorn RM322-023-222-2000 is a rectangular MIL-Spec connector from the R Series, designed for board mount receptacle applications. It features a vertical orientation with a plastic body and three rows of contacts. The component utilizes a 1.91 mm (0.075 inch) pitch and provides 23 circuits. Termination is achieved via through-hole mounting with pre-tinned tin/lead alloy tails measuring 0.172 inches in length. It includes a fixed jackset and mounting ears for secure installation.
Verify the specific termination style and tail length requirements against the target PCB layout before ordering. Confirm that the pre-tinned tin/lead alloy composition aligns with applicable environmental regulations for the intended deployment region. Ensure compatibility with the corresponding male plug counterpart within the R Series family to guarantee proper mechanical and electrical interface alignment during assembly.
Select this model when a 23-position, three-row receptacle with through-hole termination is required. The fixed jackset configuration distinguishes it from guide set variants. Verify that the 3 A current rating and 750 V voltage rating meet the circuit demands. Consider the operating temperature range of -65 C to +125 C for environmental suitability.
This component belongs to the AirBorn R Series, a line of rectangular connectors adhering to MIL-DTL-55302 standards. The series offers various row counts and termination options, including press-fit and through-hole configurations. The RM322 prefix indicates a specific receptacle variant within this standardized military-grade connector ecosystem.
Cross-reference with other R Series part numbers sharing the same 23-position count and through-hole termination. Verify identical pitch and mounting ear configurations to ensure mechanical interchangeability without redesigning the host board structure.
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