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SI3410DV-T1-E3 is listed in the Single FETs, MOSFETs range at ChipApex. The manufacturer field lists Vishay Siliconix. Its product description is MOSFET N-CH 30V 8A 6TSOP. Review the specifications below when checking this part for your BOM.
The Vishay Siliconix Si3410DV-T1-E3 is a single N-channel MOSFET utilizing TrenchFET technology, housed in a TSOP-6 surface-mount package. It features a drain-source voltage rating of 30 V and a continuous drain current capacity of 8 A at a case temperature of 25 °C. The device exhibits a maximum on-state resistance of 0.0195 Ω at VGS = 10 V and 0.023 Ω at VGS = 4.5 V. Total gate charge is typically 9.2 nC at VGS = 4.5 V. Operating junction temperatures range from -55 °C to 150 °C.
Verify the specific ordering suffix against official documentation to confirm compliance requirements. The -E3 suffix indicates lead-free composition, while -GE3 denotes both lead-free and halogen-free status. Confirm that the requested part number matches the exact electrical specifications and package dimensions required for the target circuit design before finalizing procurement.
Select this component based on its low on-resistance characteristics suitable for efficient power management. Ensure the thermal environment supports the specified power dissipation limits. Verify that the gate drive voltage aligns with the RDS(on) specifications provided for optimal conduction efficiency. Consider the TSOP-6 package constraints regarding PCB land pattern and mounting orientation during layout.
This component belongs to the Vishay Siliconix Si3410DV series of N-channel enhancement mode field effect transistors. Manufactured using advanced silicon planar trench technology, it offers high density and fast switching capabilities. The product line is designed for portable applications requiring compact footprints and reliable operation under varying thermal conditions.
Cross-reference datasheets for alternative TSOP-6 N-channel MOSFETs with matching 30 V ratings and comparable RDS(on) values. Ensure pinout compatibility and verify that thermal resistance parameters meet system requirements when substituting.
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